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IC TAIWAN GRAND CHALLENGE, GLOBAL CALL FOR PROPOSALS

Deadline: June 30, 2024

The Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) is a collaborative effort by various Taiwanese government ministries, leveraging Taiwan’s semiconductor expertise by integrating chips with key innovations

It aims to discover promising teams early and connect them with Taiwan. It will spotlight global startups and academic groups focusing on IC design innovations and Chip-based innovative applications. Top selections will be invited to establish bases in Taiwan, linking them with funding to advance chip innovations, leveraging the world's most comprehensive semiconductor industry ecosystem to support creative endeavors.

Eligibility:

  • Startups, legal entities, academic research institutions, and  individuals that plan to collaborate with Taiwan’s semiconductor industry.
  • Must be a startup set up after January 1, 2016.
  • Must own or have legal access to the intellectual property rights of the product, technology, or solution.
  • Teams applying for Online Competition must submit Concept Paper detailing core technology, solved situations, future issues and solutions for Taiwan, business model, and market expansion plans.

Categories / Areas of Focus

Advanced technologies or solutions for the following areas of development:

Category 1 - IC design innovations: Academic research or startup with proprietary IC design technology and core IP, planning and developing innovative chips.

Category 2 - Chip-based innovative applications: Academic research or startup with domain knowledge in various industries and planning to combine existing chip technologies for implementation, such as the following topics:

➢  Smart Data & Security (cyber-security, quantum computing, digital economy)
➢  Smart Mobility (electric vehicles, autonomous driving, smart cities)
➢  Smart Manufacturing (intelligent manufacturing, IC process, robots)
➢  Smart Medtech (biometrics, smart monitoring)

➢  Sustainability (sustainable manufacturing, energy-saving innovation)

How Apply:

Please register on-line: https://ictaiwanchallenge.org/

Key Dates

1st Round On-line Application Deadline: June 30, 2024

  • Application will be initially reviewed. Candidates will be notified based on the results if they proceed to secondary review.
  • Candidates that pass the initial review must submit the “IC Innovation Acceleration Platform Resource Requirement Application Form”.
  • Secondary review consists of a 20-minute online presentation and Q&A.
  • Results will be announced two weeks after review, based on application volume.

Benefits of Participation Awards:

  • Prize: Up to US$30,000.
  • Mentoring by Semiconductor Industry Experts
  • IC Innovation Acceleration Platform: Industry Links and Guidance of Chip Development in Taiwan
  • Landing Resources & Services to Ensure Success

For more details, please refer to the details from the official website:

2024 IC Taiwan Grand Challenge: https://ictaiwanchallenge.org/ 

Deadline: June 30, 2024
Posted on: June 13, 2024
Industry: data security, security, mobility, manufacturing, Medtech, sustainability, biometrics

The Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) is a collaborative effort by various Taiwanese government ministries, leveraging Taiwan’s semiconductor expertise by integrating chips with key innovations

It aims to discover promising teams early and connect them with Taiwan. It will spotlight global startups and academic groups focusing on IC design innovations and Chip-based innovative applications. Top selections will be invited to establish bases in Taiwan, linking them with funding to advance chip innovations, leveraging the world's most comprehensive semiconductor industry ecosystem to support creative endeavors.

Eligibility:

  • Startups, legal entities, academic research institutions, and  individuals that plan to collaborate with Taiwan’s semiconductor industry.
  • Must be a startup set up after January 1, 2016.
  • Must own or have legal access to the intellectual property rights of the product, technology, or solution.
  • Teams applying for Online Competition must submit Concept Paper detailing core technology, solved situations, future issues and solutions for Taiwan, business model, and market expansion plans.

Categories / Areas of Focus

Advanced technologies or solutions for the following areas of development:

Category 1 - IC design innovations: Academic research or startup with proprietary IC design technology and core IP, planning and developing innovative chips.

Category 2 - Chip-based innovative applications: Academic research or startup with domain knowledge in various industries and planning to combine existing chip technologies for implementation, such as the following topics:

➢  Smart Data & Security (cyber-security, quantum computing, digital economy)
➢  Smart Mobility (electric vehicles, autonomous driving, smart cities)
➢  Smart Manufacturing (intelligent manufacturing, IC process, robots)
➢  Smart Medtech (biometrics, smart monitoring)

➢  Sustainability (sustainable manufacturing, energy-saving innovation)

How Apply:

Please register on-line: https://ictaiwanchallenge.org/

Key Dates

1st Round On-line Application Deadline: June 30, 2024

  • Application will be initially reviewed. Candidates will be notified based on the results if they proceed to secondary review.
  • Candidates that pass the initial review must submit the “IC Innovation Acceleration Platform Resource Requirement Application Form”.
  • Secondary review consists of a 20-minute online presentation and Q&A.
  • Results will be announced two weeks after review, based on application volume.

Benefits of Participation Awards:

  • Prize: Up to US$30,000.
  • Mentoring by Semiconductor Industry Experts
  • IC Innovation Acceleration Platform: Industry Links and Guidance of Chip Development in Taiwan
  • Landing Resources & Services to Ensure Success

For more details, please refer to the details from the official website:

2024 IC Taiwan Grand Challenge: https://ictaiwanchallenge.org/ 


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