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Leading Japanese manufacturer of functional materials seeks startups for development of new applications for electric de-bonding technology

Deadline: October 15, 2021

Company

Our company is expanding its business globally by providing various products in the electronics industry, automobiles, housing, infrastructure, environment and medical related fields, based on its core technologies of adhesive technology and coating technology. One of the main products is adhesive tape. Adhesive products are required to have adhesive reliability, as well as peelability that can be easily peeled off when desired. For example, in a semiconductor manufacturing process, it is required to have both adhesive reliability that protects the surface during wafer processing and peelability that allows the wafer to be peeled off cleanly without any residue. We have launched ELEP HOLDERTM, which is lightly peeled by UV light, and REVALPHATM, which is lightly peeled by heat. They are widely used in electronic product manufacturing processes around the world.

Electric de-bonding technology

We developed the electric de-bonding system as a new technology.

This technology has advantages:

  • Easy peeling: The de-bonding force is reduced to 1/10 to 1/1000 by applying voltage to the adhesive.
  • Voltage: The function is exhibited when a voltage of 10 V or higher is applied.
  • Static resistance: Despite the property of de-bonding when a voltage is applied, it does not de-bond due to a momentary increase in voltage such as static electricity.
  • Adherend selectivity: It can be performed with a conductive material, and stainless steel, aluminum, etc. are suitable
  • Applicable configuration: When the conductive materials are fixed to each other, a single-layer structure is preferable. In the case of fixing the conductive material and the non-conductive material, a double-sided tape structure with a conductive film is preferable.

We are seeking startups that want to design products and develop business using electric de-bonding technology.

Examples:

  • Startups that want to add electric de-bonding function to their products.
  • Startups that have apps / ideas that can be solved using this technology.
  • Startups that want to replace / recover brittle or expensive parts without damaging them.
Deadline: October 15, 2021
Posted on: September 17, 2021
Location: E-meeting (WebEx, Skype, Zoom, etc.) or in-person meeting
Key Words:
adhesive, coatings, debonding, semiconductor

Company

Our company is expanding its business globally by providing various products in the electronics industry, automobiles, housing, infrastructure, environment and medical related fields, based on its core technologies of adhesive technology and coating technology. One of the main products is adhesive tape. Adhesive products are required to have adhesive reliability, as well as peelability that can be easily peeled off when desired. For example, in a semiconductor manufacturing process, it is required to have both adhesive reliability that protects the surface during wafer processing and peelability that allows the wafer to be peeled off cleanly without any residue. We have launched ELEP HOLDERTM, which is lightly peeled by UV light, and REVALPHATM, which is lightly peeled by heat. They are widely used in electronic product manufacturing processes around the world.

Electric de-bonding technology

We developed the electric de-bonding system as a new technology.

This technology has advantages:

  • Easy peeling: The de-bonding force is reduced to 1/10 to 1/1000 by applying voltage to the adhesive.
  • Voltage: The function is exhibited when a voltage of 10 V or higher is applied.
  • Static resistance: Despite the property of de-bonding when a voltage is applied, it does not de-bond due to a momentary increase in voltage such as static electricity.
  • Adherend selectivity: It can be performed with a conductive material, and stainless steel, aluminum, etc. are suitable
  • Applicable configuration: When the conductive materials are fixed to each other, a single-layer structure is preferable. In the case of fixing the conductive material and the non-conductive material, a double-sided tape structure with a conductive film is preferable.

We are seeking startups that want to design products and develop business using electric de-bonding technology.

Examples:

  • Startups that want to add electric de-bonding function to their products.
  • Startups that have apps / ideas that can be solved using this technology.
  • Startups that want to replace / recover brittle or expensive parts without damaging them.

Application Requirements

In your response, please include:

  • Concisely what you offer & your match with the company above and their interest
  • Any relevant cases / customer stories (can indicate industry/size if not ready to go public)
  • Application Requirements

    In your response, please include:

    • Concisely what you offer & your match with the company above and their interest
    • Any relevant cases / customer stories (can indicate industry/size if not ready to go public)

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